| abstract |
(57) [Abstract] [Problem] It is possible to perform thermal bonding at a low temperature and has excellent adhesive strength without deteriorating the heat resistance of polyimide resin. Obtain excellent heat-resistant adhesive. A contains a reactive compound with the softened temperature polyimide resin softening temperature of T a ℃ (A) is a T b ℃ (B), the softening temperature of the composition before curing X ° C., polyimide resin in the composition the content of (a) Y a%, the reactive compound (B) When the content of the Y b%, α = (T a -X) * (Y a + Y b) / [(T a -T b ) A curable composition wherein α in * Y b ] is 0.3 to 2.0. |