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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-363
filingDate 1998-12-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c8734ccba10a3c170bc777a98e96c15f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6a416e29d4b27883486ba58729224015
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_659ebe6abbb8941c3736070526f9258e
publicationDate 2000-07-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2000197990-A
titleOfInvention Brazing paste
abstract (57) [Summary] [Problem] It is possible to braze at a temperature of 700 ° C. or less, obtain a strong joint without voids and carbide residues, and until the brazing material melts even when applied on a vertical surface. A brazing paste that does not run off is realized. SOLUTION: P having a weight of 2 to 11%, 0.9 to 10%. Homopolymerization of 100 parts by weight of an alloy powder containing Ni and 4 to 26% of Sn, the balance being Cu, and a compound in which one α substituent of the α, α-2-substituted vinyl monomer is a methyl group or 0.5 to 20 parts by weight of a polymer having a weight average molecular weight of 10,000 to 200,000 obtained by copolymerization, and 5 to 20 parts by weight of an organic solvent having a boiling point of 250 ° C. or less and containing no aromatic group. And 20 parts by weight. At the joint boundary with the base material Cu, a strong alloy bond in which the primary crystal of Sn is diffused can be formed, and at the brazing filler metal portion, there are no carbides or voids, and compounds such as CuP and NiP have a tough multi-element eutectic structure. ing.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-104028918-A
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2017057651-A1
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10610981-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2004034054-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2017057651-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I666085-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2012070262-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-1308110-C
priorityDate 1998-12-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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