http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2000195637-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d12f09e2e9797cb2f098f10afcf35c05 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-112 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-325 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01R12-716 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01R12-57 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R1-0483 |
| classificationIPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-11 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-32 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R1-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01R33-76 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-26 |
| filingDate | 1999-12-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d03f4a95c5daa5e90c1f2f5d6f9d42bf |
| publicationDate | 2000-07-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2000195637-A |
| titleOfInvention | Test socket for wafer and BGA element with CSP element formed |
| abstract | PROBLEM TO BE SOLVED: To provide a test having a contact element capable of a wiping action to improve electrical conductivity between a wafer on which a CSP element is formed and a solder ball formed on a BGA element. Is to provide a socket. SOLUTION: When a contact is made with a solder ball of a BGA element 1, the surface of the solder ball has an inclined surface so that a uniform pressing force is applied, and a long hole having a through groove 12 formed at the center thereof is arranged in a two-dimensional array. The inclined surface of the long hole 2 and the through groove 12 are formed. A contact block 10 having a surface coated with a conductive material, A contact block installation groove 21 for mounting the contact block 10 is formed, and a BG is provided above the contact block installation groove. A housing on which a mounting portion is formed so that the A element 1 can be seated; Use the test socket of the device. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007242438-A |
| priorityDate | 1998-12-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 24.