http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2000191711-A

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_2ba60be3b3f99c87e117c7f7c20b7071
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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L67-06
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filingDate 1998-12-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f1a113bf8febaf547f5fc4f37cc0832a
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publicationDate 2000-07-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2000191711-A
titleOfInvention Curable resin composition
abstract PROBLEM TO BE SOLVED: To avoid the necessity of storing a thermal polymerization initiator for curing by conventional thermal polymerization at a low temperature, and to blend a fiber reinforcing material, filler, pigment, etc. in curing by photopolymerization. The present invention provides a curable resin composition capable of efficiently polymerizing and curing even a product. SOLUTION: The polymerization initiator comprises (A) a polymerizable unsaturated compound, (B) an organic boron compound represented by the following general formula (1), and a compound having one 5-membered ring of an imidazole skeleton in the molecule. A curable resin composition comprising: (Wherein, R 1, R 2, R 3 and R 4 are each independently an alkyl group, an aryl group, an aralkyl group, an alkenyl group, an alkynyl group, a silyl group, a heterocyclic group, or a halogen atom, Z + Represents a cation.)
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010144109-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-110709429-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-110709429-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11053372-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2018225466-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2018225465-A1
priorityDate 1998-12-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 28.