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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L81-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L79-08
filingDate 1998-12-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_07aad3633685d3b8430a41b40f0fa7a9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3300498d0002b52da1b53ab07082f9f1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_df7bcd163b8f58674b37dc62d9e6dd0a
publicationDate 2000-06-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2000178446-A
titleOfInvention Resin composition
abstract (57) [Problem] To provide a material excellent in heat resistance, melt fluidity, strength and toughness by blending an aromatic polyamideimide resin and a polyphenylene sulfide resin. (A) When reacting an aromatic tricarboxylic acid anhydride, or an aromatic tricarboxylic acid anhydride and an aromatic tetracarboxylic acid anhydride with a diisocyanate compound, after the amidation reaction is completed at least 70%. , An aromatic polyamide-imide resin obtained by performing an imide group formation reaction, (B) polyphenylene sulfide resin and (C) polyphenylene sulfide resin, are mixed with: (a) an ethylenic double bond; (b) a carboxyl group, an acid Anhydride group, A resin composition comprising a modified polyphenylene sulfide resin obtained by modification with a modifying agent selected from the group consisting of a hydroxyl group and an epoxy group.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4639752-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006120947-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002179912-A
priorityDate 1998-12-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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