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filingDate 1998-12-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7061c4c60aded3bce4671cc01549de7e
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publicationDate 2000-06-23-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2000171987-A
titleOfInvention Method for producing base material for electronic component and resist remover used therefor
abstract PROBLEM TO BE SOLVED: To use a resist remover which has high safety and meets the required performance for removing unnecessary resist film adhered to a peripheral portion, an edge portion and a back surface portion of a substrate. In addition, the present invention provides a manufacturing method for obtaining a base material for electronic components having excellent performance. SOLUTION: A coating solution for forming a radiation-sensitive resist film is applied to a substrate surface, dried, and then dried at least in a peripheral portion of the substrate. When manufacturing an electronic component substrate by dissolving and removing an unnecessary resist film adhering to the edge portion and the back surface portion using a resist removing agent, the resist removing agent is used as the resist removing agent. An organic solvent having a surface tension at a temperature of more than 35 dyne / cm and less than 60 dyne / cm and having solubility in a radiation-sensitive resist film is used.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7884062-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2018181963-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4643467-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2007063985-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2007097233-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007227645-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007256710-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101011854-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007324393-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007179043-A
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