http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2000169554-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 |
| filingDate | 1998-12-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ac00bde840d86a9ded01005a0caf3934 |
| publicationDate | 2000-06-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2000169554-A |
| titleOfInvention | Epoxy resin composition for semiconductor encapsulation and semiconductor device |
| abstract | (57) [Problem] To provide an epoxy resin composition excellent in solder stress resistance and long-term heat resistance. An epoxy resin containing an epoxy resin represented by the formula (2) in an amount of 30 to 100% by weight in all epoxy resins, A phenolic resin containing two or more phenolic hydroxyl groups in one molecule, an inorganic filler as an essential component, and an epoxy resin composition for semiconductor encapsulation wherein the inorganic filler in the total resin composition is 75 to 93% by weight, and the same. A semiconductor device in which a semiconductor element is encapsulated by a method. Embedded image |
| priorityDate | 1998-12-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 57.