| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_be055db3c1a09879df07379ba969e223 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01016
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01029
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01028
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01023
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48247
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01078
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01322
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0105 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49582 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C22C13-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-14 |
| filingDate |
1998-11-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_203ed09db2cb514ecfb78d5e2a1730cc
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f6a5a12cb035f439e514610d167c7fc9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_42f30d66f4f8fa2da9c5d1000976ef04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f50d766055a407fa7238d3782f28b30b |
| publicationDate |
2000-06-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2000164782-A |
| titleOfInvention |
Semiconductor device having lead-free tin-based solder film and method of manufacturing the same |
| abstract |
[PROBLEMS] To provide a semiconductor device and a semiconductor device manufacturing method using an electronic component lead frame which does not contain lead which is an environmentally harmful pollutant and has good solder wettability and good bonding strength characteristics. SOLUTION: The present invention provides a lead frame formed of nickel or a nickel alloy, copper or a copper alloy, and iron or an iron alloy, wherein an inner lead portion is provided with a surface treatment layer of silver or an alloy containing silver, and an outer lead is provided. The solution is achieved by forming a surface treatment layer of at least silver and an alloy containing tin having a body-centered square structure preferentially oriented in the (101) plane and / or the (211) plane. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-2053656-A3
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6677056-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6575354-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2001098396-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2001089894-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4547583-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-2385550-A1 |
| priorityDate |
1998-11-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |