| abstract |
PROBLEM TO BE SOLVED: To provide a manufacturing method for forming a contact structure on a flat surface of a substrate. The method includes: (a) forming a sacrificial layer on the surface of a silicon substrate; (b) forming a conductive layer of an electrically conductive material on the sacrificial layer; and (c) forming a photoresist on the conductive layer. Forming a layer, (d) aligning a photomask on the photoresist layer, exposing the photoresist layer with ultraviolet light, and (e) forming an image comprising photoresist grooves on the surface of the photoresist layer (development) (F) using an electroplate process to form a contact structure of an electrically conductive material in the grooves of the photoresist, (G) removing the photoresist layer, (h) removing the sacrificial layer in a first etching step to separate the contact structure from the silicon substrate, and (i) conducting the conductive layer from the contact structure in a second etching step. , And consists of each step. |