http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2000156567-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f4a8faea375370b67c9d71e67db32bcd |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-13 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 |
| filingDate | 1998-11-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7fe5b1aeae5aa631d685908dc570af7b http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e1b03bd2f6ea065a36a14f93d645ad09 |
| publicationDate | 2000-06-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2000156567-A |
| titleOfInvention | Wiring board and method of manufacturing the same |
| abstract | (57) Abstract: A through hole conductor cannot be formed on an insulating base at a high density. A photo-cured ceramic sheet (11a) having a through hole (13) penetrating in a thickness direction by irradiating light to a predetermined position of a photosensitive ceramic green sheet (11) and photo-curing and developing a photosensitive resin composition in a predetermined area. The wiring conductor layer 15 and the through-hole conductor layer 16 having a predetermined pattern are formed on the surface of the photocurable ceramic sheet 11a and in the through-hole 13, and finally, the wiring conductor layer 15 and the through-hole conductor The photo-cured ceramic sheet 11a on which the layer 16 is formed is fired to form the wiring conductor layer 2 and the through-hole conductor layer 3 inside and on the surface of the insulating base 1. |
| priorityDate | 1998-11-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 171.