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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G14-073
filingDate 1999-04-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b888bfcf14bb74a511cb3d0b9fab3dbf
publicationDate 2000-06-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2000154225-A
titleOfInvention High heat resistance and low dielectric constant thermosetting resin
abstract (57) [Problem] To provide a thermosetting resin which has both excellent heat resistance and low dielectric constant characteristics and is useful as an electronic material. SOLUTION: The dihydroxybenzoxazine resin has A method of reducing the density of the polar group in the resin is applied, and a compound having a structure represented by the general formula (1) and / or a ring-opened polymer thereof has a carbon number of 4 to 12 carbon atoms as R 1 in the structure. As the hydrogen group, a hydrocarbon group having 10 or less carbon atoms is introduced as R 2 and R 3 . Embedded image
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