http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2000151117-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 |
| filingDate | 1998-11-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8c5e19633f060bf8acb55d3cf649b413 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_51769f5c0a0336b472b0ff5941b070dc http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_20f09179a6e6d2197e58d9e89ddf92fd http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f0329b788258dca37623b3d5be5eb119 |
| publicationDate | 2000-05-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2000151117-A |
| titleOfInvention | Manufacturing method of multilayer printed wiring board |
| abstract | (57) [Problem] To provide a method of manufacturing a multilayer printed wiring board excellent in productivity and hole quality of interlayer connection holes. A method of manufacturing a multilayer printed wiring board using an epoxy resin cured product containing a halogen atom for an insulating layer, the method comprising: forming an interlayer connection hole; A method of removing with an etchant comprising a compound, an amide-based solvent, and an alcohol-based solvent, and updating the etching ability of the etchant consumed in the etching process by replacing a part of the etchant. Manufacturing method of printed wiring board. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002265913-A |
| priorityDate | 1998-11-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 211.