http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2000151051-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_669c01133740c5233f2c8738904ea3af |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-44 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-11 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-05 |
| filingDate | 1999-06-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e64de4188a5443e8e0d7f2233946d7c7 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d4b211de01b69e5819e79ce55752c07c |
| publicationDate | 2000-05-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2000151051-A |
| titleOfInvention | Wiring board and its manufacturing method |
| abstract | (57) Abstract: A wiring board having fine wiring formed on at least one surface of a base substrate and having a highly reliable filling-type through hole for electrical connection. Provided is a wiring board which is reliable in terms of surface. SOLUTION: A sheet-like metal material provided with a plurality of through holes at predetermined positions and provided with an electrodeposition resin layer having adhesive insulating properties on the surface except for at least one surface portion of the through holes is used as a base substrate. A through-hole is formed by filling a conductive material into a through-hole of a base substrate to form a through hole of a filling type, and one or more wiring portions are formed on one or both surfaces of the base substrate. In order to use the sheet-shaped metal material portion of the base substrate as a ground substrate, a part of the wiring is inserted into the through-hole portion of the metal material having no electrodeposition resin layer on its surface. It is connected to the metal material through the provided filling type through hole. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4526747-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11506937-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006210770-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2003060343-A |
| priorityDate | 1998-09-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 50.