http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2000150714-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_696ca0ae93d5cf5a686273601361781f |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48227 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73265 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-05 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12 |
| filingDate | 1998-11-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_22bccf4e7640f08285550ec8cbc42184 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4a5b7f0e52066114ce8a24b4d555b34d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6067b0bb69604ac7b27d222adb57edf1 |
| publicationDate | 2000-05-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2000150714-A |
| titleOfInvention | Printed wiring board for semiconductor plastic package |
| abstract | (57) [Problem] To provide a printed wiring board for a semiconductor plastic package having excellent connectivity between an inner layer metal plate and an outer layer metal foil, heat radiation, heat resistance after moisture absorption, and the like. SOLUTION: This is a printed wiring board for a semiconductor plastic package of a ball grid array using a metal plate provided with a double-sided truncated conical protrusion, wherein the protrusion formed on the metal plate has a copper layer formed on a die pad side surface and A printed wiring board having a structure electrically connected to a copper layer formed on the heat-dissipating solder ball pad side surface on the back surface. [Effect] Connectivity between the inner metal plate and the outer copper layer, heat dissipation, Provided is a printed wiring board for a semiconductor plastic package having a novel structure that is excellent in heat resistance after absorbing moisture and is suitable for mass production. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009049062-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002020511-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-114678335-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6670699-B2 |
| priorityDate | 1998-11-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 66.