http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2000150688-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8a25bfd91c883be967b15c27983cb95e |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-16195 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K5-06 |
| filingDate | 1998-11-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3d8cf25a4fb61092c45432b13a12d5d3 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_24a31a8cbd8b7b2ab8a1421d4ac125f0 |
| publicationDate | 2000-05-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2000150688-A |
| titleOfInvention | Package for electronic components |
| abstract | [PROBLEMS] To pressurize at the time of hermetically sealing a metal cover using solder on a metallized portion formed on the upper surface of an outer frame of a package body having a concave portion on the upper surface. It is possible to solve the conventional problem that a part of the solder protrudes from between the package body and the metal lid to increase the rate of defective products due to the variation in the position, the pressing force, and the variation in the amount of solder. Provide a package for electronic components that can be used. SOLUTION: In a state where electronic components are stored in a package main body 20 having a concave portion 21 on an upper surface, a metal lid 30 is covered via a solder 32 on a metallized portion 25 provided on an upper surface of an outer frame of the package main body. In the electronic component package having a structure in which the metal lid is heated while being pressurized, and then cooled, the metal lid is fixed on the metallized portion and the recess is hermetically sealed. A plurality of small projections 40 as the same spacer were projected in a predetermined arrangement. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-5853702-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2003258143-A |
| priorityDate | 1998-11-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
| Predicate | Subject |
|---|---|
| isDiscussedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23964 http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID425762086 |
Total number of triples: 17.