| abstract |
(57) [Summary] In a wiring structure formed by embedding a metal, Voids and the like are generated due to defective embedding of metal, resulting in poor connection, resulting in reduced reliability. Further, the contact resistance was increased due to the barrier metal layer in the contact portion. SOLUTION: A concave portion (for example, a connection hole, a groove, or a connection hole formed at the bottom of the groove) connected to a conductor 12 formed in the insulation film 11 and formed in the insulation film 11 is provided. 13, a barrier metal layer 14 formed on the side wall of the recess 13, and metal material bodies 15 and 16 embedded in the recess 13, wherein the metal material bodies 15 and 16 are formed a plurality of times. The metal material 15 and the conductor 12 are directly connected to each other. |