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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_294881271413951a95f284b588a68e66
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-288
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-16
filingDate 1998-11-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2b55d3a62eb524584327c6edf3f4eb76
publicationDate 2000-05-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2000150422-A
titleOfInvention Method for manufacturing electrode of semiconductor device
abstract An object of the present invention is to provide a method for manufacturing an electrode of a semiconductor device, which can form an electrode at low cost and with high precision without using a conventional evaporation method, sputtering method or the like. When an electrode is formed by performing an electroless plating process on a silicon wafer W capable of generating a photovoltaic force, the silicon wafer W is disposed inside a light shielding housing 10 and irradiated with the silicon wafer W. A light-shielding state is formed in which light is blocked, and electroless plating is performed in this light-shielding state.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008085368-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2004327519-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-101986422-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4549636-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012031453-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006284797-A
priorityDate 1998-11-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 33.