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(57) [Abstract] [Problem] To provide a low dielectric constant suitable for use in a printed wiring board. Provided is a thermosetting low-dielectric resin composition having a low dielectric loss tangent and excellent in adhesiveness to metal and scattering of resin during operation, and a laminate, a metal foil-clad laminate and the like using the same. The component (a) a siloxane-modified polyimide, Thermosetting low-dielectric resin composition comprising component (b) a compound represented by formula (1) containing two methylallyl groups and component (c) a compound containing two or more maleimide groups, and lamination using the composition Board and metal foil clad laminate. Embedded image |