http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2000138454-A

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f4a8faea375370b67c9d71e67db32bcd
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46
filingDate 1998-10-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7fe5b1aeae5aa631d685908dc570af7b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e1b03bd2f6ea065a36a14f93d645ad09
publicationDate 2000-05-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2000138454-A
titleOfInvention Wiring board manufacturing method
abstract (57) Abstract: A wiring conductor layer and a through-hole conductor layer cannot be formed at a high density. A photocurable ceramic sheet (1a) having a through hole (3) penetrating in a thickness direction by irradiating light to a predetermined position of a photosensitive ceramic green sheet (1) and developing the light. Is formed, and then a photosensitive conductive paste is applied on the surface of the photocurable ceramic sheet 1a and in the through holes 3. A predetermined position of the photosensitive conductive paste is irradiated with light and developed to develop a wiring conductor layer 7 and a through-hole conductor layer 8. Finally, a plurality of the photocurable ceramic sheets 1a are vertically stacked and fired to form the wiring conductor layer 7a and the through-hole conductor layer 8a inside and on the surface of the insulating base 1b made of ceramic.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2004008818-A1
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priorityDate 1998-10-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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