http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2000131836-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_623d02c6091d38f6b59470d9ab8ce72c |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-035 |
| filingDate | 1998-10-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d3e65077a881a3e369b25580e1dc11ed http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_04540b878c34b10ec1ad64e50af2d09b http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1d9aae909fa1205417a7c51f1813374b |
| publicationDate | 2000-05-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2000131836-A |
| titleOfInvention | Photosensitive resin composition and solder photoresist ink composition for circuit board |
| abstract | (57) [Problem] To provide a photosensitive resin composition which can be developed with a dilute aqueous alkali solution and has excellent heat resistance and weather resistance in a cured portion, and a conventional dilute alkali development type solder photoresist ink composition. Solder photoresist ink composition for circuit boards that significantly improves the flexibility of the cured film, makes it applicable to flexible substrates, and has excellent dilute alkali developability, solder heat resistance, and especially pressure cooker resistance, which are important properties of resist ink. Offer things. A compound (a) having two or more hydroxyl groups and one or more carboxyl groups, a polyfunctional isocyanate (b) having a 6-membered ring structure, and a (meth) acrylate (c) having a hydroxyl group ) Having a carboxyl group obtained by reacting (A) A photosensitive resin composition containing a photopolymerization initiator (B) and a diluent (C), and a solder photoresist ink composition for a circuit board containing the composition and a bifunctional or more epoxy resin (D). |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4611554-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4623890-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-109884859-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002229201-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002156754-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007128851-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2005124462-A1 |
| priorityDate | 1998-10-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 115.