http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2000119369-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ead90443277482e25bf91bfddef2b5a7 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-20 |
| filingDate | 1998-10-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_97958c7617122121448259d44335f7a5 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8896389057e9be1306a662309cac1896 |
| publicationDate | 2000-04-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2000119369-A |
| titleOfInvention | Solid epoxy resin, epoxy resin composition and cured product thereof |
| abstract | (57) [Abstract] [Problem] With excellent solid handling properties, It is to provide a crystalline epoxy resin which is solid at room temperature and shows good low viscosity in a molten state, and further has excellent blocking resistance, and is excellent in moldability such as rapid curability, fluidity, and mechanical properties. Provided is an epoxy resin composition excellent in strength, heat resistance, low moisture absorption, high adhesion, and crack resistance, and a cured product thereof. A solid epoxy resin obtained by subjecting a liquid epoxy resin or an epoxy resin-containing solution produced by epoxidizing 2,7-naphthalene diol with epichlorohydrin to a crystallization treatment, and having a melting point peak temperature of 50%. 25 ° C. when the particle size is not less than 5 ° C. and not more than 5 mm A solid epoxy resin having a blocking ratio of 20% or less after standing for 24 hours. An epoxy resin composition comprising an epoxy resin, a curing agent and an inorganic filler, wherein the epoxy resin composition contains the epoxy resin as an epoxy resin component in an amount of 10% by weight or more and further contains an inorganic filler in an amount of 75% by weight or more. And a cured product obtained by curing the epoxy resin composition. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2012132923-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008031344-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9914662-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2018095608-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2017098879-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2017019883-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2017098879-A1 |
| priorityDate | 1998-10-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 112.