| abstract |
(57) [Problem] To provide an epoxy resin composition for semiconductor encapsulation which hardly generates hydrogen and carbon monoxide during curing, and is excellent in productivity and reliability, and a semiconductor device using the same. thing. (A) An epoxy resin (B) a phenolic resin curing agent having two or more hydroxyl groups in one molecule (C) a curing accelerator (D) an oxidizing agent and (E) an inorganic filler as essential components, The oxidizing agent of (D) is CuO, Ag 20 , PbO 2 , B a semiconductor element is sealed by a i 2 O3, 1 kind selected from among MnO 2 or sealant in combination with more. |