http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2000103962-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_358a329cc314c43da9d13d9d90a7db83 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J2379-00 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L79-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J5-18 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L79-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L79-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 |
| filingDate | 1998-09-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ebc6f6dff8b0ed19a55244fc2ca47e9c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4a1696a906e24f5dd20294dc319a119a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ea97dc342059b34130964c95cf228920 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c93597b55ef33543a91fdb09a66593ce |
| publicationDate | 2000-04-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2000103962-A |
| titleOfInvention | Film sealant for electronic parts |
| abstract | (57) [Summary] [PROBLEMS] To solve the problems of the prior art and to have good workability, it is possible to perform a continuous sealing operation without requiring an expensive device, thus increasing the cost. Provided is a film-like sealant for electronic components which is free from heat and has excellent heat resistance and electrical insulation after sealing. SOLUTION: The structure of the film sealant for an electronic component of the present invention comprises a polycarbodiimide resin and an epoxy resin, and the polycarbodiimide resin has a number average molecular weight of 3,000 in terms of polystyrene by gel permeation chromatography. To 50,000, and the epoxy resin is a polycarbodiimide resin 10 It is characterized by containing 20 to 150 parts by weight to 0 parts by weight, or comprising a polycarbodiimide resin, an epoxy resin and a colorant, wherein the polycarbodiimide resin is obtained by gel permeation chromatography in terms of polystyrene. Number average molecular weight of 3000 to 50 000, wherein the epoxy resin is contained in an amount of 20 to 150 parts by weight based on 100 parts by weight of the polycarbodiimide resin. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2004331728-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4493929-B2 |
| priorityDate | 1998-09-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 81.