http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2000103836-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 |
| filingDate | 1998-09-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_76f0e69ac4228c6d63edf76c24c08141 |
| publicationDate | 2000-04-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2000103836-A |
| titleOfInvention | Epoxy resin composition and semiconductor device |
| abstract | (57) [Summary] [PROBLEMS] For semiconductor encapsulation, which does not cause a decrease in fluidity during storage at room temperature, has excellent curability during molding, and has good solder crack resistance, moisture resistance, and temperature cycle resistance. To provide an epoxy resin composition. SOLUTION: The epoxy resin represented by the formula (1) is used in combination with an orthocresol-novolak type epoxy resin, the epoxy resin containing 30 to 60% by weight of the orthocresol-novolak type epoxy resin, a phenol resin curing agent, a formula (2) And a fused silica powder containing 50% by weight or more of a curing accelerator represented by the formula: wherein the mixing ratio of the epoxy resin and the phenolic resin curing agent is such that the phenolic hydroxyl group 1 and the epoxy group are 1.1 to 1.4. The epoxy resin composition for semiconductor encapsulation having a ratio of: Embedded image Embedded image |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100414202-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-02065542-A3 |
| priorityDate | 1998-09-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 43.