http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2000101238-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_669c01133740c5233f2c8738904ea3af |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 |
| filingDate | 1998-09-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_946c4ffaafb4ccb4369d5f22bbd903fa |
| publicationDate | 2000-04-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2000101238-A |
| titleOfInvention | Transfer member and transfer member manufacturing method |
| abstract | (57) [Summary] [PROBLEMS] A multi-layered wiring portion sequentially transferred on a base substrate, capable of responding to finer and higher-density wiring, requiring no complicated process, and suitable for mass production. The present invention provides a transfer member for transferring a wiring layer, which makes it possible to manufacture a multi-layer wiring board that can also respond to quality with a multi-layer wiring board provided with. SOLUTION: This is a transfer member for transferring and forming a conductive layer serving as a wiring portion to a transfer material via a viscous adhesive layer serving as an adhesive layer, and is at least capable of being plated. A polyimide having a plate-shaped conductive base material having plating releasability and a first opening which is laminated on one surface of the conductive base material and has a predetermined shape in accordance with the shape of a wiring portion to be produced. A resin layer, a conductive layer serving as a wiring portion provided by plating on one surface of the conductive base material so as to fill the first opening of the polyimide resin layer, and A second opening is provided which includes a region where the adhesive portion is formed by laminating the wiring portion region and the adhesive layer when the wiring portion is transferred, and which is opened in a region larger than these regions. Metal layer. |
| priorityDate | 1998-09-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 26.