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filingDate 1998-09-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9cf1ba16132bf0354bb953e92d231d20
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publicationDate 2000-04-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2000100653-A
titleOfInvention Chip-type multilayer electronic components
abstract (57) Abstract: Provided is a chip-type multilayer electronic component capable of preventing oxidation of a terminal electrode when an electronic component is mounted on a substrate and achieving good electrical bonding between the terminal electrode and an internal electrode. A main component of a terminal electrode connected to an internal electrode is made of silver / palladium, and the weight ratio is 7: 3 to 3: 2. 7, and 0.1 to 1.0 part by weight of boron is added to 100 parts by weight of the main component.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7018864-B2
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type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 30.