| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_dc45703f67bc72a6db582867886fd5d5 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00013
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0237
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13144
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-361
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-1134 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01P1-047
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01P5-08 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-02 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01P11-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01P1-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01P5-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01P3-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01P5-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01P3-02 |
| filingDate |
1998-09-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_309440d4cf747c4105d2a6ebd82ee31f |
| publicationDate |
2000-03-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2000091818-A |
| titleOfInvention |
Method of manufacturing film type transmission line and method of connecting the line |
| abstract |
(57) [Summary] [PROBLEMS] To facilitate highly reliable connection with little impedance mismatch. A connection exposure portion is formed by partially removing a film substrate by laser etching or the like while leaving a transmission line pattern. Connection exposed part 1 The film-type transmission line 10 is arranged so that 6 overlaps the transmission line pattern 24 on the connected side. 2 superimposed Bonding, for example, thermocompression bonding is performed on the two line patterns. No gold ribbon, In addition, superposition of the dielectric substrate 22 and the film substrate 12 is unnecessary, and impedance mismatch is reduced. Bonding can be performed without using the film substrate 12, and a highly reliable connection state can be obtained. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7532085-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011160291-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100384401-B1 |
| priorityDate |
1998-09-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |