http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2000091717-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_44b2ac87aeadb161b83426d9cf6c4bdc |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L25-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L23-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01Q13-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01P11-00 |
| filingDate | 1998-09-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_72aa51a8a4535e0375138240b36db2bb http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f851ee144d65a602cfaa53625582b2cb |
| publicationDate | 2000-03-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2000091717-A |
| titleOfInvention | Millimeter wave system |
| abstract | (57) [Summary] [PROBLEMS] A substrate has low loss, a small coefficient of thermal expansion, excellent adhesion between substrates and a metal conductive layer, and easy multilayering. Low dielectric constant, low dielectric loss tangent, easy formation of patterns and via holes, pattern is not too fine, can be manufactured in the same manufacturing process as general copper-clad board, and high-density mounting To provide a small, high-performance, low-cost millimeter-wave system capable of The circuit includes a wiring board on which a part of a circuit of a millimeter wave subsystem is formed at least on a front surface and / or a back surface, and an antenna electrically connected to a circuit on the wiring board. The circuit on the wiring board 1 has a circuit element 5 connected by a bump structure 5a. The wiring board 1 is a resin composition comprising one or more resins having a weight-average absolute molecular weight of 1000 or more, wherein the sum of the number of carbon atoms and hydrogen atoms in the composition is 99% or more. A millimeter-wave system in which there is a heat-resistant low-dielectric polymer material in which some or all of the resin molecules have a chemical bond with each other. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20220151024-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-03032696-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11784417-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-112599958-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11309639-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007060127-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8053677-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7754970-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016121334-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007266443-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7841076-B2 |
| priorityDate | 1998-09-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 105.