| abstract |
PROBLEM TO BE SOLVED: To provide a resin composition, an adhesive, an adhesive film, and a lead using the same, which can be adhered to an adherend at a low temperature, have excellent heat resistance, and are particularly suitable for fixing an inner lead. A frame and a semiconductor device are provided. SOLUTION: A resin composition containing a copolymer obtained by reacting the following (A), (B) and (C). (A) dicarboxylic acid, tricarboxylic anhydride or tetracarboxylic dianhydride, (B) diamine or diisocyanate, (C) an elastomer represented by the general formula (I), HOOC-R 1 -COOH ( I) (where R 1 represents a hydrogenated polybutadiene residue, a hydrogenated polyisoprene residue or a polyisobutylene residue) |