| abstract |
(57) [Problem] An epoxy resin composition which is excellent in filling property of a thin portion, has no defects such as voids, has excellent crack resistance due to toughness, and has excellent reliability such as moisture resistance. Thus, an insulated and sealed inductance component and a semiconductor sealing device are provided. SOLUTION: A resin component containing (A) a liquid epoxy resin mixed with a reactive diluent as required and (B) an inorganic filler, and (C) hydrogenated methylnadic acid or an anhydride thereof as a curing agent. (D) An epoxy resin composition, which is a two-part electrical insulating material, obtained by mixing a curing agent component containing an imidazole compound as a liquid curing accelerator, and a cast of the epoxy resin composition. And a coil and a semiconductor chip are insulated and sealed by a cured product, and an inductance component and a semiconductor sealing device. |