| abstract |
(57) [Summary] (Modified) [PROBLEMS] A novel epoxy-based polymer, an epoxy resin composition containing the polymer, and having excellent heat resistance and adhesion to metals such as aluminum, and the epoxy resin composition A highly reliable semiconductor device and circuit board sealed with an object. SOLUTION: Expression (1) (R1, R2 are hydrogen, an alkyl group, an alkoxy group, a halogen, a fluoroalkyl group, a phenyl group); a polymer having a repeating unit structure represented by the formula: Conductive pastes, semiconductor devices, and circuit boards using the same. |