http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2000080246-A

Outgoing Links

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B22C1-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L61-00
filingDate 1998-09-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1f78c3303e84219e8b26d1756412f9a7
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publicationDate 2000-03-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2000080246-A
titleOfInvention Thermosetting resin composition for resin coated sand for mold
abstract (57) [Problem] The present invention relates to a thermosetting resin containing formaldehyde, and an object of the present invention is to provide a thermosetting resin composition capable of significantly suppressing the generation of formaldehyde. SOLUTION: The solution is that the thermosetting resin composition contains formaldehyde and contains at least one selected from hydrazo compounds.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007177255-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-03037849-A3
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2005515170-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008024820-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1674515-A1
priorityDate 1998-09-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

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Total number of triples: 30.