| abstract |
[57] [Problem] It is possible to cure both in-line curing method (hot plate curing, HP curing) and batch method (oven curing) that are common in IC manufacturing, and it has sufficient adhesive strength and low stress. And provide a resin paste having a long pot life. SOLUTION: Liquid epoxy resin, phenol curing agent, A resin paste for semiconductors comprising a latent curing agent, an epoxy-modified alkoxysilane coupling agent, an organic borate salt, and an inorganic filler. |