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filingDate 1998-08-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ea88fa15780b8fcb074a5e8c3048c3e8
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_86617ac0bc0c7d86bfc0f0a1ad1e0266
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publicationDate 2000-03-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2000071167-A
titleOfInvention Polishing pad
abstract (57) [PROBLEMS] To hold a polishing slurry on a polishing pad surface because a conventional groove formed on a polishing pad surface has the same width at the shallowest part of the groove and the width at the deepest part of the groove. The polishing properties and fluidity and the removal efficiency of polishing debris from the polishing pad surface are insufficient, and there is a limit to improving the polishing rate and reducing scratches. This is intended to be improved in the present invention. A polishing pad in which the width of the shallowest part of the groove is wider than the width of the deepest part of the groove.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013034018-A
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-5585081-B2
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