| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_2dcebf5a7f7ddc3b081f70e8ce1c4097 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-373
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-12 |
| filingDate |
1998-08-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b623303e8900beeeebd19110e8035d2e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1d7d4aee91bf6ad074ceac61497d281b |
| publicationDate |
2000-02-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2000064084-A |
| titleOfInvention |
Plating material for heat sink of electronic parts |
| abstract |
(57) [Problem] To provide a plating material for a heat sink having Ni or a Ni alloy plating on the surface of a copper alloy base material and having excellent adhesion to a resin. SOLUTION: Ni or Ni alloy plating surface is ESCA When analyzed, the intensity ratio of the Ni2P oxide and hydroxide peaks to the metal peaks is in the range of 0.1 to 0.8 and the plating gloss is 1.5 or less. Ni alloy plating material. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2021153504-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002334960-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2006028208-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100844258-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7430106-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2001342580-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006080401-A |
| priorityDate |
1998-08-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |