| abstract |
(57) [Problem] To provide a solder plated wire which is less likely to cause a thermal creep phenomenon even in a high temperature environment, has excellent heat resistance at a soldered joint, and does not contain a harmful lead component. SOLUTION: Bismuth is 1.0 to 30.0% by weight and silver is 0.5%. The plating layer 3 having a composition of about 10.0% by weight, 0.01% to 2.0% by weight of copper, and the balance of tin and inevitable impurities is Solder-plated wire 1 provided on the outer periphery of. |