http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2000049259-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 |
| filingDate | 1998-06-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8d67169aef85e39791a3afd9b4da2600 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_811ab8641038f3084fcbbf2559147976 |
| publicationDate | 2000-02-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2000049259-A |
| titleOfInvention | Epoxy resin molding material for sealing and electronic component device |
| abstract | (57) [Summary] [PROBLEMS] For mounting on a wiring board, it is possible to perform soldering without performing a specific pre-treatment, and to provide an excellent sealing such as reflow resistance and moisture resistance. Provide an epoxy resin molding material. (A) an epoxy resin; and (B) a melting point of 160. The bisphenol compound having a content of the bisphenol compound (B) of the component (A) which is a bisphenol compound having a content of the bisphenol compound of the component (B) of not more than (C) or less, (C) an adduct of a tertiary phosphine and a quinone, and (D) an inorganic filler as essential components. 3 to 3 parts by weight An epoxy resin molding material for encapsulation, wherein the content of the inorganic filler (D) is 60 to 80% by volume based on 0 parts by weight. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008255155-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2006064568-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2001279057-A |
| priorityDate | 1998-05-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 116.