| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_399d433982220f3203f7f18db8c9aa28 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R1-067
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67242
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L22-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-66
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R1-073
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R1-067
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-26 |
| filingDate |
1998-07-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fdaf33c9cd1e898e22512f70f43831e3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d548a583eab00f7a4ace3c28d577fa47
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_170bfe674a8f8a403e0547d610815097
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_75fdd6e5fc44ed7f4f14b22bdae2e674 |
| publicationDate |
2000-02-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2000046867-A |
| titleOfInvention |
Conductive contact holder and method of manufacturing the same |
| abstract |
PROBLEM TO BE SOLVED: To improve the accuracy of the amount of protrusion of a conductive needle-like body and to improve the position accuracy of a wafer at the time of multipoint simultaneous measurement in a high-temperature atmosphere. A plate constituting a holder is formed by laminating a first silicon layer, a silicon oxide film, and a second silicon layer. A small-diameter hole 7 is formed in the film 5 and a large-diameter hole 8 is formed in the second silicon layer 6. The head 9a of the conductive needle 9 is supported by the small-diameter hole 7 and the conductive needle 9 is supported. The conductive contact 1 is formed by receiving the flange portion 9b of FIG. 9 and the compression coil spring 10 by the large-diameter hole portion 8. Since the amount of protrusion is regulated by the flange portion colliding with the silicon oxide film, the amount of protrusion of the conductive needle-like body can be made highly accurate. In particular, since the material is the same as that of the silicon wafer, the position between the needles in the case of simultaneous multi-point measurement in a test in a high-temperature atmosphere of the wafer does not shift. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2005083773-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I634336-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2003107130-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7677901-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2003215160-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8087956-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009186210-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100945518-B1 |
| priorityDate |
1998-07-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |