| abstract |
(57) Abstract: A curable adhesive composition for bonding an electronic element substrate. SOLUTION: This is a thermoplastic or thermosetting adhesive for bonding an electronic element to a substrate, wherein at least one kind of polyfunctional or monofunctional maleimide compound, or at least one kind of polyfunctional or monofunctional compound other than maleimide compound. An adhesive composition which comprises a curable composition comprising a functional vinyl compound or a combination of a maleimide compound and a vinyl compound, a curing initiator, and optionally one or more fillers, and is cured in situ. |