http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2000039450-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_44ff3005508304394801e265e503b811 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-66 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R1-073 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-26 |
| filingDate | 1998-07-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_35f1c40ad505e5fe027dac9790bac674 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e80d566830541f2208873428e167e497 |
| publicationDate | 2000-02-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2000039450-A |
| titleOfInvention | Burn-in board, bumped membrane ring and manufacturing method thereof |
| abstract | PROBLEM TO BE SOLVED: To provide a membrane ring with a bump, a burn-in board, and the like which can meet the needs for improving the mechanical strength of pads and bumps, the durability of electrical contacts, and the reliability. SOLUTION: This is a membrane ring with bumps, which serves as a contact portion in a burn-in board used for collectively performing a burn-in test of a large number of semiconductor devices formed on a wafer, and a membrane 2 stretched over the ring 1. Has a bump 3 on one surface thereof for contacting each semiconductor device, and has a pad 4 on the other surface of the membrane 2 for contacting the multilayer wiring board, through a bump hole formed through the membrane 2. In the membrane ring with bumps 10 having a structure in which the bumps 3 and the pads 4 are connected, the pad 4 A metal binder layer (Ni, etc.) Film containing metal that does not oxidize (Au, Au-Co alloy, etc.) To form |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100446429-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-03015155-A1 |
| priorityDate | 1998-07-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 24.