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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0f705f295f4ba571f5311e5ef1b57807
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46
filingDate 1998-07-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9bc1639599acb95189945dbb8fd45216
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_714d62ce42690127f6a3d4eb7388a833
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8ba32d0e76fbe24ef94157768b74899f
publicationDate 2000-01-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2000031643-A
titleOfInvention Multilayer printed wiring board and method of manufacturing the same
abstract (57) [Problem] To further improve adhesion between a conductor circuit and a resin insulating layer and adhesion between a conductor circuit and a via-hole conductor. A lower-layer conductor circuit and a lower-layer conductor circuit are provided. A multilayer printed wiring board 52 having the interlayer resin insulating layer 37 is provided. Multilayer printed wiring board 52 of the present invention The lower conductor circuit 26 has a roughened surface 35 treated with an etching solution containing a cupric complex and an organic acid, and the roughened surface 35 is formed of titanium, aluminum, zinc, It is covered with a metal layer made of at least one metal selected from the group consisting of iron, indium, thallium, cobalt, nickel, tin, lead, bismuth and a noble metal, and the interlayer resin insulating layer 37 is formed on the roughened surface 35 It is provided in.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-101394711-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2004349693-A
priorityDate 1998-07-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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