abstract |
(57) [Problem] To provide an epoxy resin composition which provides a semiconductor device with less voids and burrs and excellent fluidity. SOLUTION: (A) an epoxy resin having two or more epoxy groups in one molecule, (B) a phenol resin having two or more phenolic hydroxyl groups in one molecule, (C) a quinone compound, and (D) An epoxy resin composition containing a curing accelerator as an essential component. |