| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b55c349b43c3ecba4977fd52cc8f8c67 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73204 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-10 |
| filingDate |
1998-07-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f912a1a5acd1fd911180f630af79bbc9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e69d14ba09b87f6de2f6b07b126360f0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0753945198b475d9e2b805edff734f29 |
| publicationDate |
2000-01-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2000026602-A |
| titleOfInvention |
Heat-fusible polyimide resin film, semiconductor device using the same, and multilayer wiring board |
| abstract |
(57) [Problem] To provide a heat-fusible polyimide resin film that can be thermocompression-bonded at a lower temperature than before. The problem is solved by a heat-fusible polyimide resin film formed from a heat-fusible polyimide resin represented by the following general formulas (1) to (6). Embedded image Embedded image Embedded image Embedded image Embedded image Embedded image |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2018186262-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2018059075-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2018028073-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2018030410-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2018186262-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2018062190-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2007116979-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11566108-B2 |
| priorityDate |
1998-07-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |