| abstract |
(57) [Summary]nAn object of the present invention is to provide a semiconductor device with a lead frame. Resin with good adhesiveness is required, and Polyimide, BGA substrate resin (acrylic Epoxy with good adhesion to Strong demand for resin.nAn epoxy compound represented by the following formula (1).nEmbedded imagen (Where R 1 ~ R 8 represents hydrogen, an alkyl group, an alkene group, Or a halogen group, G is a glycidyl group, n is 0 or 1 respectively. ) |