http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2000007900-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7acd9416af412b5972feb55a5e652ea2 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-32 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L83-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-68 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 |
| filingDate | 1998-09-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3ea6193d27d14f9c789d8caa47ec1f6d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a248e9ac1fda821c61ad943941740c5d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d1db7d1b2d5c754e4c7eeaec5aefc220 |
| publicationDate | 2000-01-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2000007900-A |
| titleOfInvention | Epoxy resin composition for sealing and semiconductor device |
| abstract | (57) [Summary] [PROBLEMS] To provide excellent mold releasability and significantly reduce mold stains and stains on the surface of a molded product as compared with conventional molds. Therefore, the mold cleaning cycle can be extended and continuous moldability can be improved. Provided is an epoxy resin composition which is excellent in fluidity and excellent in fluidity, and a semiconductor device with less contamination on the surface of a molded product. SOLUTION: In an epoxy resin composition containing an epoxy resin, a curing agent, a curing accelerator, and an inorganic filler, a cresol novolak epoxy resin having a binuclear content of 10% or less is used as the epoxy resin, or As a curing agent, a phenol novolak resin in which a low molecular weight substance having two or less binucles is controlled to 10% or less is used. Further, in a semiconductor device in which a semiconductor element is encapsulated with an epoxy resin composition, the epoxy resin composition according to the present invention is used as the epoxy resin composition, or The curing agent according to the present invention is used as the epoxy resin composition. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007063402-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2003246828-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002249546-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2023120739-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-5034500-B2 |
| priorityDate | 1998-04-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 58.