| abstract |
A thermoplastic composite material is presented which includes a thermoplastic matrix which is highly loaded with a charge of coated ceramic material. In an important feature of the present invention, the filler of ceramic material has been coated with a rubbery polymer which binds to the filler. In a preferred embodiment, the thermoplastic matrix comprises a fluoropolymer, preferably a chlorofluoropolymer and the charge of ceramic material is fused amorphous silica coated with a rubbery polymeric material. The thermoplastic composite material of the present invention has numerous advantages which make it well suited for use as an adhesion film, in particular an adhesion film to produce multilayer printed circuit boards. |