http://rdf.ncbi.nlm.nih.gov/pubchem/patent/IE-41858-B1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_da54f7ebbd2d9d8a82f92aca4d1b4e48 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-02 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-56 |
| filingDate | 1975-09-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 1980-04-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | IE-41858-B1 |
| titleOfInvention | Improvements in or relating to the electrodeposition of nole metal alloys |
| abstract | 1526216 Electro-depositing gold, silver or platinum group metal alloys SCHERING AG 18 Sept 1975 [20 Sept 1974] 38393/75 Heading C7B A Au, Ag or Pt group metal alloy is electrodeposited from a CN ion-free bath containing thiosulphato-complex, e.g. Na3 Ag(S 2 O 3 ) 2 , Na 3 Au(S 2 O 3 ) 2 , K 2 Pd (S 2 O 3 ) 2 , Na 4 Ag(S 2 O 3 ) 3 , Na 4 Au2(S203)3, Na 4 Pd(S 2 O 3 ) 3 or Na 12 Au 2 (S 2 O 3 ) 7 . The bath may contain at least two such complexes, or their precursors, e.g. Na3 Au(SO 3 ) 2 , Ag 2 O, PdSO 4 , AgSO 4 , AgCl, AgNO 3 , PD (EDTA Na 2 ) 2 , NaAuCl 4 or K 2 PdCl 4 reduced with thiosulphate, and/or at least one of Cu, Cd, Co, Ni, As, Sb, Mn, In, Zn, Pd or Sn as sulphate, chloride, nitrate, acetate, citrate or (for As) arsenite, or as a complex, e.g. amine, chelate or thiosulphate complex such as Cu (EDTA Na 2 ) 2 . The bath may contain excess thiosulphate (to convert any CN- containing salts initially present to thiocyanate) e.g. of NH 4 and/or alkali metal (Na or K) or adducts with (poly) amines, particularly with soluble Ag or Cu anodes. With insoluble platinized Ti or C anodes, a reducing agent such as alkali metal (Na or K) nitrite, oxalate or sulphite may be added. The bath may also contain one or more conductive salts and/or buffers, e.g. ammonium or alkali metal sulphate, sulphite, carbonate, (tetra) borate (such as Na 4 B 4 O 7 ), sulphamate, acetate, citrate, phosphate, metabisulphite, glycine, or a mixture of boric acid and ethylene glycol. Examples of alloys electro-deposited are Au-Ag, Au-Cu, Au-Pd, Ag-Ni, Ag-Pd, Ag-Cu, Ag-Cd, Au-Cu-Cd, Au-Ag-Cu, Ag-Cu-Cd, Ag-Cu-Zn, Ag-Au-Cu, or Au-Ag-Cu-Pd (using a taurine complex for the Pd). Specification 1526215 is referred to. |
| priorityDate | 1974-09-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 136.