http://rdf.ncbi.nlm.nih.gov/pubchem/patent/HU-221985-B1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_43bac6eddf46d0b6cdaedefb0e49bf73 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_91c8886118108ad1f369d82212f39acc |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-00 |
| filingDate | 2000-11-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_43aa72919e984ed956e05adc52f80206 |
| publicationDate | 2003-03-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | HU-221985-B1 |
| titleOfInvention | Flux for soldering on a soldering machine |
| abstract | Field of the Invention The present invention relates to a non-corrosive non-corrosive non-corrosive fluxing agent for soldering electronic components with tin-lead alloys, which is advantageously used in soldering devices. The fluxing agent is characterized in that from 0.01 to 20.00% by weight of organic carboxylic acid and / or rosin as an activator, from 0.01 to 5.00% by weight of phthalic acid ester as a foaming agent0.01 to 3.00% by weight of chlorinated hydrocarbon and / or or a 1-methyl-2-pyrrolidone-amine doping enhancer and a density-increasing additive and a 75-99% by weight alkanol mixture as carrier vehicle. Advantageously, the components provide an even surface distribution of the activator (such as uniformly wetting the surface to be soldered) and an excellent area of the solder during the soldering process, in addition to optimum flux application. ŕ |
| priorityDate | 2000-11-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 32.