http://rdf.ncbi.nlm.nih.gov/pubchem/patent/HU-0303965-A2
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e757fd4fedc4fe825bb81b1b466a0947 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00014 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-10253 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49827 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-538 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-498 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-04 |
| filingDate | 2002-04-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3998772b1206fa0b7cc6ac940b672676 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a851cccc4459b407e7fcd75bfcf00b25 |
| publicationDate | 2004-03-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | HU-0303965-A2 |
| titleOfInvention | Integrated circuit package and method for connecting integrated circuit elements to functional circuit unit |
| abstract | The present invention relates to an integrated circuit package and to a method for connecting integrated circuit elements into a functional circuit unit. High-density contacts and wiring between and within the chips are located on the side of the base plate (3) on which the integrated circuit is mounted, and there is a connection to the external signal and supply network through the opposite side. The use of a silicon base plate (3) allows the use of conventional silicon processing processes available in the art to create high wiring densities, and at the same time allows the coefficient of thermal expansion of any silicon chip in integrated circuits to be matched. The bushings (4) through the base plate (3) allow the use of a high density of connections leaving the silicon base plate (3) and provide short paths for the supply voltage and signal voltage connections. HE |
| priorityDate | 2001-04-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 36.