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classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K13-02
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http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K13-02
filingDate 1962-08-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_587965a1e18a6e4267713532104f8177
publicationDate 1965-03-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber GB-987043-A
titleOfInvention Improved polyamide resins
abstract Synthetic linear polyamides are stabilized against the degradative effects of exposure to heat and oxygen by the incorporation with the polyamide during or after manufacture of a hydrochloride, hydrobromide or hydroiodide of pyridine or triethanolamine in an amount of from 0.05 to 3% by weight of the polyamide together with a copper compound soluble in the polyamide in an amount of from 0.001 to 0.03% by weight of the polyamide and/or phosphorous or phosphoric acid in an amount of from 0.1 to 1% by weight of the polyamide. The examples describe the polymerization of hexamethylene diammonium adipate in the presence of copper acetate, anatase titanium dioxide and: (1) pyridine hydroiodide and (2) triethanolamine hydroiodide.
priorityDate 1958-07-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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